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Tech Valley News
Cabot, IBM to Partner on CMP Technology
Cabot Microelectronics Corporation has entered into an agreement with IBM to jointly develop chemical mechanical planarization technology for next-generation integrated circuit (IC) devices.
Under the agreement, Cabot Microelectronics will utilize its industry-leading CMP experience and resources to collaboratively address IBM’s 32 and 22 nanometer technology challenges and develop effective CMP solutions for a variety of applications, including new materials.
"For almost twenty years, since the early days of CMP technology, we have had a productive and collaborative relationship with IBM as an important customer, and we believe that this joint development program reflects and furthers this positive relationship and our ability to bring value to IBM and its customers," said William P. Noglows, Cabot Microelectronics' chairman and chief executive officer.
"IBM is excited to be collaborating with Cabot Microelectronics in order to deliver leading edge CMP solutions," said Paul Farrar, vice president SRDC process development for IBM. "The fast pace of development makes it critical for materials suppliers and device makers to work together closely early in the research and development cycle in order to advance process technology."
The research for this joint development program will take place in conjunction with IBM Research at Albany NanoTech and at Cabot Microelectronics’ research and development center.
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